The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

Sun-Kyong Oh; Bock Hur; Hyeon-Cheol Kim

doi:10.5395/JKACD.2004.29.3.273

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Original Article The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel: Sun-Kyong Oh, Bock Hur, Hyeon-Cheol Kim; Journal of Korean Academy of Conservative Dentistry 2004;29(3):273-280.
DOI: https://doi.org/10.5395/JKACD.2004.29.3.273
Published online: May 31, 2004

Department of Conservative Dentistry, College of Dentistry, Pusan National University, Korea.

Corresponding author: Bock Hur. Department of Conservative Dentistry, College of Dentisty, Pusan National University, 1-10 Ami-dong, Seo-gu, Pusan, 602-739, Korea. Tel: 82-51-240-7454, bhur@pusan.ac.kr

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Abstract
REFERENCES

Abstract

The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test.

The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM), Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth, and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test, resin-bonded teeth were sectioned to give a bonded surface area of 1mm². Microtensile bond strength test was perfomed.

The results of this study were as follows.

1. A definite etching pattern was observed in Scotchbond Multi-Purpose group.

2. Self-etching groups were characterized as shallow and irregular etching patterns.

3. The results (mean) of microtensile bond strength were SM; 26.55 MPa, SE; 18.15 MPa, LP; 15.57 MPa. SM had significantly higher microtensile bond strength than SE and PL (p < 0.05), but there was no significant differance between SE and PL.
Keywords: Etching effect; Microtensile bond strength; Total etching; Self etching; Enamel; Scanning electron microscopy

REFERENCES

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Figure 1

The SEM photographs of resin replica using Scotchbond Multi-Purpose

Figure 2

The SEM photographs of resin replica using Clearfil SE Bond

Figure 3

The SEM photographs of resin replica using Adper Prompt L-Pop

Table 1

Composition of three dentin bonding systems

Table 2

Procedures of bonding agent application

Table 3

Microtensile bond strengths(MPa, Mean ± SD)

Tables & Figures

REFERENCES

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The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

J Korean Acad Conserv Dent. 2004;29(3):273-280. Published online May 31, 2004

DOI: https://doi.org/10.5395/JKACD.2004.29.3.273

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Figure

The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

Figure 1 The SEM photographs of resin replica using Scotchbond Multi-Purpose

Figure 2 The SEM photographs of resin replica using Clearfil SE Bond

Figure 3 The SEM photographs of resin replica using Adper Prompt L-Pop

Figure 1

Figure 2

Figure 3

The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

Table 1

Composition of three dentin bonding systems

Table 2

Procedures of bonding agent application

Table 3

Microtensile bond strengths(MPa, Mean ± SD)

Table 1 Composition of three dentin bonding systems

Table 2 Procedures of bonding agent application

Table 3 Microtensile bond strengths(MPa, Mean ± SD)