The purpose of this study was to compare the microshear bond strength (uSBS) of two total-etch and four self-etch adhesive systems and a flowable resin to enamel.
Enamels of sixty human molars were used. They were divided into one of six equal groups (
After enamel surfaces were treated with six adhesive systems, a flowable composite resin (Filek Z 350) was bonded to enamel surface using Tygon tubes. the bonded specimens were subjected to uSBS testing and the failure modes of each group were observed under FE-SEM.
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3. Adhesive failures in TY and GB group and mixed failures in SB group and SE group were often analysed. One cohesive failure was observed in OS, SB, SE and AP group, respectively.
Although adhesives using the same step were applied the enamel surface, the uSBS of a flowable resin to enamel was different.
Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode.
Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM.
There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups.
The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.
The purpose of this study was to evaluate the effect of multiple application of all-in-one dentin adhesive system on microtensile bond strength to caries-affected dentin.
Twenty one extracted human molars with occlusal caries extending into mid-dentin were prepared by grinding the occlusal surface flat. The carious lesions were excavated with the aid of caries detector dye. The following adhesives were applied to caries-affected dentin according to manufacturer's directions; Scotchbond™ Multi-Purpose in SM group, Adper Prompt L-Pop™ 1 coat in LP1 group, 2 coats in LP2 group, 3 coats in LP3 group, Xeno® III 1 coat in XN1 group, 2 coats in XN2 group, and 3 coats in XN3 group. After application of the adhesives, a cylinder of resin-based composite was built up on the occlusal surface. Each tooth was sectioned vertically to obtain the 1 × 1 mm2 sticks. The microtensile bond strength was determined. Each specimen was observed under SEM to examine the failure mode. Data were analyzed with one-way ANOVA.
The results of this study were as follows;
1. The microtensile bond strength values were; SM (14.38 ± 2.01 MPa), LP1 (9.15 ± 1.81 MPa), LP2 (14.08 ± 1.75 MPa), LP3 (14.06 ± 1.45 MPa), XN1 (13.65 ± 1.95 MPa), XN2 (13.98 ± 1.60 MPa), XN3 (13.88 ± 1.66 MPa). LP1 was significantly lower than the other groups in bond strength (p < 0.05). All groups except LP1 were not significantly different in bond strength (p > 0.05).
2. In LP1, there were a higher number of specimens showing adhesive failure. Most specimens of all groups except LP1 showed mixed failure.
The purposes of this study were to evaluate the effect of adhesive property on microtensile bond strength and to determine the failure mode.
Flat occlusal dentin surfaces were prepared using low-speed diamond saw. The dentin was etched with 37% phosphoric acid. The following adhesives were applied to the etched dentin to manufacturer's directions; Scotchbond Multi-Purpose in group SM, Prime&Bond NT in group NT, Scotchbond Multi-Purpose followed by Tetric-flow in group TR. After adhesive application, a cylinder of resin-based composite was built up on the occlusal surface. Each tooth was sectioned vertically to obtain the 1 × 1mm2 "sticks". Microtensile bond strength were determined. Each specimen was observed under stereomicroscope and scanning electron microscope (SEM) to examine the failure mode. Data were analyzed using one way ANOVA.
The results of this study were as follows;
1. The microtensile bond strength value were; group SM (18.98 ± 3.01MPa), group NT (16.01 ± 4.82MPa) and group TR (17.56 ± 3.22MPa). No significant statistical differences were observed among the groups (P>0.05).
2. Most of specimens showed mixed failure. In group TR, there was a higher number of specimens showing areas of cohesive failure in resin.
The purpose of this study was to compare shear bond strength and interfacial pattern of composite bonded to dentin using self-etching adhesive systems.
Sixty extracted human molars with exposed occlusal dentin were divided into four groups and bonded with four adhesives and composites: Single Bond/Filtek Z 250(SB), Tyrian SPE-One-Step Plus/Aelitefil(TY), Prompt L-Pop/Filtek Z 250(LP), and One-Up Bond F/Palfique Toughwell(OU).
The results of this study were as follows;
Shear bond strength for OU was significantly lower than that of other groups(p<0.05). No significant difference was founded among SB, TY, and LP. Failure modes to dentin showed adhesive and mixed for SB, TY, and LP, but them for OU showed adhesive in all spceimens. Dentin-resin interface showed close adaptation for SB, TY, and LP, but it showed gap for OU. The hybrid layers for TY, LP, OU were thinner than that of SB. Adhesive layers were observed between composite and hybrid layer, which were 5 µm thick for TY and 10 µm thick for OU.