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Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives
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Basic Research Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives
So-Rae Seong, Duck-kyu Seo, In-Bog Lee, Ho-Hyun Son, Byeong-Hoon Choorcid
Journal of Korean Academy of Conservative Dentistry 2010;35(2):125-133.
DOI: https://doi.org/10.5395/JKACD.2010.35.2.125
Published online: March 31, 2010

Department of Conservative Dentistry, School of Dentistry, Seoul National University, Seoul, Korea.

Corresponding Author: Byeong-Hoon Cho. Department of Conservative Dentistry, School of Dentistry, Seoul National University, 275-1 Yeongeon-Dong, Jongno-Gu, Seoul, 110-768, Korea. Tel: 82-2-2072-3514, Fax: 82-2-2072-3859, chobh@snu.ac.kr
• Received: March 2, 2010   • Revised: March 11, 2010   • Accepted: March 12, 2010

Copyright © 2010 Korean Academy of Conservative Dentistry

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  • Objectives
    Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode.
  • Methods
    Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM.
  • Results
    There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups.
  • Conclusion
    The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.
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Figure 1
SEM micrograph of the bonded interfaces treated with 6 N HCl and 3.5% NaOCl of MP group. No cracks were observed at the junction of the adhesive layer and the hybrid layer or between adhesive layer and composite resin in both continuous curing group (a) and exponential curing group (b).
jkacd-35-125-g001.jpg
Figure 2
The failure mode distribution of tested specimens.
C: continuous curing group, E: exponential curing group
MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt.
jkacd-35-125-g002.jpg
Figure 3
SEM micrograph of the dentin surface of a debonded specimen in SB-continuous curing group. (a) Low magnification view (× 100). Adhesive failure and brittle failure pattern was observed. (b) High magnification view (× 1000). The dentinal tubules and fractured resin tags indicate failure at the interface between the adhesive layer and dentin.
jkacd-35-125-g003.jpg
Figure 4
SEM micrograph of the dentin surface of a debonded specimen in SB-continuous curing group. (a) Low magnification view (× 100). Mixed failure mode was observed through the adhesive layer (A), composite resin (R) and hybid layer (H). (b) High magnification view at the area H (× 1000). The dentinal tubules were covered partially by remnants of adhesive.
jkacd-35-125-g004.jpg
Table 1
The composition of the materials used in this study
jkacd-35-125-i001.jpg
Table 2
The mean microtensile bond strengths (MPa) of tested specimens (Mean ± SD; N, numbers of specimens)

MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt

*The same superscripts denote no statistical difference between groups (Tukey test; p > 0.05, uppercase letters = columns; lowercase letters =rows).

jkacd-35-125-i002.jpg
Table 3
The failure modes of tested specimens

One specimen in MP - continuous curing group was lost before failure mode analysis.

A: adhesive failure, M: mixed failure, Cd: cohesive failure in dentin, Cr: cohesive failure in resin

MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt

jkacd-35-125-i003.jpg

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        Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives
        J Korean Acad Conserv Dent. 2010;35(2):125-133.   Published online March 31, 2010
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      Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives
      Image Image Image Image
      Figure 1 SEM micrograph of the bonded interfaces treated with 6 N HCl and 3.5% NaOCl of MP group. No cracks were observed at the junction of the adhesive layer and the hybrid layer or between adhesive layer and composite resin in both continuous curing group (a) and exponential curing group (b).
      Figure 2 The failure mode distribution of tested specimens. C: continuous curing group, E: exponential curing group MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt.
      Figure 3 SEM micrograph of the dentin surface of a debonded specimen in SB-continuous curing group. (a) Low magnification view (× 100). Adhesive failure and brittle failure pattern was observed. (b) High magnification view (× 1000). The dentinal tubules and fractured resin tags indicate failure at the interface between the adhesive layer and dentin.
      Figure 4 SEM micrograph of the dentin surface of a debonded specimen in SB-continuous curing group. (a) Low magnification view (× 100). Mixed failure mode was observed through the adhesive layer (A), composite resin (R) and hybid layer (H). (b) High magnification view at the area H (× 1000). The dentinal tubules were covered partially by remnants of adhesive.
      Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives

      The composition of the materials used in this study

      The mean microtensile bond strengths (MPa) of tested specimens (Mean ± SD; N, numbers of specimens)

      MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt

      *The same superscripts denote no statistical difference between groups (Tukey test; p > 0.05, uppercase letters = columns; lowercase letters =rows).

      The failure modes of tested specimens

      One specimen in MP - continuous curing group was lost before failure mode analysis.

      A: adhesive failure, M: mixed failure, Cd: cohesive failure in dentin, Cr: cohesive failure in resin

      MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt

      Table 1 The composition of the materials used in this study

      Table 2 The mean microtensile bond strengths (MPa) of tested specimens (Mean ± SD; N, numbers of specimens)

      MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt

      *The same superscripts denote no statistical difference between groups (Tukey test; p > 0.05, uppercase letters = columns; lowercase letters =rows).

      Table 3 The failure modes of tested specimens

      One specimen in MP - continuous curing group was lost before failure mode analysis.

      A: adhesive failure, M: mixed failure, Cd: cohesive failure in dentin, Cr: cohesive failure in resin

      MP, Scotchbond Multipurpose Plus; AB, All Bond 2; AP, Adper Prompt


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