The aim of this study was to measure the initial dynamic modulus changes of light cured composites using a custom made rheometer. The custom made rheometer consisted of 3 parts: (1) a measurement unit of parallel plates made of glass rods, (2) an oscillating shear strain generator with a DC motor and a crank mechanism, (3) a stress measurement device using an electromagnetic torque sensor. This instrument could measure a maximum torque of 2Ncm, and the switch of the light-curing unit was synchronized with the rheometer.

Six commercial composite resins [Z-100 (Z1), Z-250 (Z2), Z-350 (Z3), DenFil (DF), Tetric Ceram (TC), and Clearfil AP-X (CF)] were investigated. A dynamic oscillating shear test was undertaken with the rheometer. A certain volume (14.2 mm³) of composite was loaded between the parallel plates, which were made of glass rods (3 mm in diameter). An oscillating shear strain with a frequency of 6 Hz and amplitude of 0.00579 rad was applied to the specimen and the resultant stress was measured. Data acquisition started simultaneously with light curing, and the changes in visco-elasticity of composites were recorded for 10 seconds. The measurements were repeated 5 times for each composite at 25±0.5℃. Complex shear modulus G^*, storage shear modulus G', loss shear modulus G" were calculated from the measured strain-stress curves. Time to reach the complex modulus G^* of 10 MPa was determined. The G^* and time to reach the G^* of 10 MPa of composites were analyzed with One-way ANOVA and Tukey's test (α= 0.05).

The results were as follows.

1. The custom made rheometer in this study reliably measured the initial visco-elastic modulus changes of composites during 10 seconds of light curing.

2. In all composites, the development of complex shear modulus G^* had a latent period for 1~2 seconds immediately after the start of light curing, and then increased rapidly during 10 seconds.

3. In all composites, the storage shear modulus G' increased steeper than the loss shear modulus G" during 10 seconds of light curing.

4. The complex shear modulus of Z1 was the highest, followed by CF, Z2, Z3, TC and DF the lowest.

5. Z1 was the fastest and DF was the slowest in the time to reach the complex shear modulus of 10 MPa.

The purpose of this study was to evaluate the bond strength of a new Single step system with different curing mode composites, and to evaluate the effect of the intermediate resins which have different hydrophilicity on bonding ability by means of the micro shear bond testing and TEM examination for the adhesive interface. The adhesive used in this study was an experimental single step system (Bisco Inc., Schaumburg, IL). Experimental groups were produced by using six kinds of intermediate resin having different hydrophilicity that was hydrophilic, hydrophobic and most hydrophobic resin and as filled or not after applying adhesive. Each experimental group was further divided into two subgroups whether the adhesive was light cured or not. Dual cured composite (Bis Core, Bisco Ltd., Schaumburg, IL) was placed on the adhesive layer as light cure or self cure mode. The results of bond strength were statistically analyzed using one way ANOVA and multiple comparisons are made using Tukey's test at α < 0.05 level.

The results of this study were as follows;

1. The application of intermediate resin did not increase the bond strength for light cured composite.

2. The bond strength of an experimental adhesive with self cured composite was significantly increased by the application of intermediate resin layer.

3. The bond strength of adhesive was irrespective of the cure or not of itself before intermediate resin layer applied.

4. As applied hydrophilic resin layer was, the initial bond strength was higher than both hydrophobic and most hydrophobic one used but there was no significance.

Using a single step adhesive with dual/self cured composite, the incompatibility between both of them should be solved by the application of intermediate hydrophobic resin to reduce the adhesive permeability. However, Single step adhesive can be used in the light cured composite restoration without any decrease of the initial bond strength.