A quantitative analysis about microleakage of all-in-one adhesives

Yong-Hee Kang; Soo-Il Shin; Dong-Hoon Shin

doi:10.5395/JKACD.2004.29.1.066

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Original Article A quantitative analysis about microleakage of all-in-one adhesives: Yong-Hee Kang, Soo-Il Shin, Dong-Hoon Shin; Journal of Korean Academy of Conservative Dentistry 2004;29(1):66-72.
DOI: https://doi.org/10.5395/JKACD.2004.29.1.066
Published online: January 31, 2004

Department of Conservative Dentistry, College of Dentistry, Dankook University, Korea.

Corresponding author: Dong-Hoon Shin. Department of Conservative Dentistry, College of Dentistry, Dankook University, san 7-1, Shinbu-dong, Cheonan, Chungnam, Korea, 330-716. Tel: 041)550-1965, Fax: 041)550-1963, donyshin@dankook.ac.kr

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Abstract
REFERENCES

Abstract

All-in-one adhesives were recently developed for reducing the techique sensitivity and chair time, but lots of concerns were made on bondability, longevity, and microleakage.

The object of this study was to evaluate microleakage and marginal quality of all-in-one adhesives using electrochemical method and SEM analysis quantitatively.

After making Class V cavities, they were bulk filled with Heliomolar(#A1) after surface treatment with three adhesives: Adper Prompt (Group A), One up bond F (Group O), Xeno III (Group X). Electrical conductivity (microamphere, µA) was checked two times: before and after cavity filling.

Percentage of leaky margin was estimated from SEM image (×1,000).

The data were statistically analysed: ANOVA and Paired T test for electrical conductivity, Kruskal-Wallis and Mann-Whitney test for marginal quality, Spearman's rho test for checking of relationships between 2 methods.

The result were as follows:

1. There was no difference in microleakage between adhesive systems and every specimen showed some of microleakage after filling.

2. Microleakage was reduced about 70% with composite resin filling.

3. Marginal quality was the best in group A, decreasing among groups in the following order: group O, followed by group X. There were significant differences between group A and group X (p=0.015), and between group O and group X (p=0.019).

4. There was no relationship between the microleakage measured by electrochemical method and marginal quality measured by SEM analysis.

Within the results of this study, there was no difference in microleakage among groups by electrical conductivity. However, significant difference in marginal quality was seen among groups. It was believed that these dissimilar results might be induced because of their own characteristics. Analysis of microleakage needs various methods for accuracy.
Keywords: Quantitative; Microleakage; Eelectrical Conductivity; Marginal adaptation; SEM; All-in-one adhesive

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Fig. 1

Schematic drawing of electrochemical test

Table 1

Composite resin used for cavity filling

Table 2

All-in-one bonding systems

Table 3

Microleakage currents before and after cavity filling (Mean (S.D.) unit (µA))

^**: significant at the p<0.01 level

Table 4

Amount of current reduction with cavity filling (Mean (S.D.) unit (%))

Table 5

Percentage of marginal gap (%)

^*: significant at the p<0.05 level

Table 6

Correlations between two methods

Tables & Figures

REFERENCES

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A quantitative analysis about microleakage of all-in-one adhesives

J Korean Acad Conserv Dent. 2004;29(1):66-72. Published online January 31, 2004

DOI: https://doi.org/10.5395/JKACD.2004.29.1.066

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Figure

A quantitative analysis about microleakage of all-in-one adhesives

Fig. 1 Schematic drawing of electrochemical test

Fig. 1

A quantitative analysis about microleakage of all-in-one adhesives

Table 1

Composite resin used for cavity filling

Table 2

All-in-one bonding systems

Table 3

Microleakage currents before and after cavity filling (Mean (S.D.) unit (µA))

^**: significant at the p<0.01 level

Table 4

Amount of current reduction with cavity filling (Mean (S.D.) unit (%))

Table 5

Percentage of marginal gap (%)

^*: significant at the p<0.05 level

Table 6

Correlations between two methods

Table 1 Composite resin used for cavity filling

Table 2 All-in-one bonding systems

Table 3 Microleakage currents before and after cavity filling (Mean (S.D.) unit (µA))

^**: significant at the p<0.01 level

Table 4 Amount of current reduction with cavity filling (Mean (S.D.) unit (%))