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The bonding durability of total etching adhesives on dentin


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The bonding durability of total etching adhesives on dentin

Article information

Restor Dent Endod. 2007;32(4):365-376
Publication date (electronic) : 2007 July 31
doi : https://doi.org/10.5395/JKACD.2007.32.4.365
Mi-Ra Jung, Gi-Woon Choi, Sang-Hyuk Park, Sang-Jin Park
Department of Conservative Dentistry, Division of Dentistry, Graduate of Kyung Hee University, Korea.
Corresponding Author: Sang-Jin Park. Department of Conservative Dentistry, Division of Dentistry, Graduate of Kyung Hee University, 1, Hoegi Dong, Dongdaemun Gu, Seoul, 130-702, Korea. Tel: 82-2-958-9335, psangjin@khu.ac.kr
Received 2007 April 10; Revised 2007 May 07; Accepted 2007 June 17.

Abstract

The purpose of this study was to evaluate the effect of different etching times on microtensile bond strength (µTBS) to dentin both initial and after thermocycling with 3 different types of total-etching adhesives.

Fifty four teeth were divided into 18 groups by etching times (5, 15, 25 sec), adhesives types (Scotchbond Multipurpose (SM), Single Bond (SB), One-Step (OS)), and number of thermocycling (0, 2,000 cycles).

Flat dentin surfaces were prepared on mid-coronal dentin of extracted third molars. After exposed fresh dentin surfaces were polished with 600-grit SiC papers, each specimen was acid-etched with 35% phosphoric acid (5, 15, 25 sec) and bonded with 3 different types of total etching adhesives respectively. Then, hybrid composite Z-250 was built up. Half of them were not thermocycled (control group) and the others were subjected to 2,000 thermocycle (experimental group). They were sectioned occluso-gingivally into 1.0 × 1.0 mm2 composite-dentin beams and tested with universal testing machine at a crosshead speed of 1.0 mm/min.

Within limited data of this study, the results were as follows

1. There was no statistically significant difference in µTBS between the thermocycled and non-thermocycled groups, except for both SM and SB etched for 25 sec.

2. In thermocycled SM and SB groups, bond strength decreased by extended etching time.

In total etching systems, adhesive durability for dentin could be affected by type of solvents in adhesive and etching time. Especially, extended etching time may cause deteriorate effects on bond strength when ethanol-based adhesive was used.

Keywords: µTBS; Etching time; Type of adhesive; Thermocycling; Total-etching systems; Ethanol-based adhesive

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Article information Continued

Copyright © 2007 Korean Academy of Conservative Dentistry
(open-access) :

This is an Open Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Figure 1

Figure 1

Classification of experimental groups by the preparation procedures.

Figure 2

Figure 2

Specimen preparation for thermocycling.

Figure 3

Figure 3

The microtensile bond strength before and after thermocycling by different etching time. A. Scotchbond Multipurpose (SM), B. Single Bond (SB), C. One Step (OS). Arrow indicates significant different (p < 0.05).

Figure 4

Figure 4

FE-SEM images of fractured surfaces after microtensile bond strength testing of SM.

B,D show mixed failure. F shows adhesive failure at the bottom of hybrid layer and resin tag are broken or left out of dentinal tubules (DT: dentinal tubule, C: composite resin, HL: hybrid layer, RT: resin tag)

Figure 5

Figure 5

FE-SEM images of fractured surfaces after microtensile bond strength testing of SB.

B,D show mixed failure. F shows adhesive failure at the bottom of hybrid layer and resin tag are broken or left out of dentinal tubules (HL: hybrid layer, DT: dentinal tubule)

Figure 6

Figure 6

FE-SEM images of fractured surfaces after microtensile bond strength testing of OS.

F shows adhesive failure at the bottom of hybrid layer and tubules are occluded by fractured resin tags (DT: dentinal tubule, HL: hybrid layer, C: composite resin)

Table 1

3 adhesives used in this study

Table 1

Table 2

Experimental modes of bonding procedure of 3 adhesives

Table 2