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The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel


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The etching effects and microtensile bond strength of total etching and self-etching adhesive system on unground enamel

Article information

Restor Dent Endod. 2004;29(3):273-280
Publication date (electronic) : 2004 May 31
doi : https://doi.org/10.5395/JKACD.2004.29.3.273
Sun-Kyong Oh, Bock Hur, Hyeon-Cheol Kim
Department of Conservative Dentistry, College of Dentistry, Pusan National University, Korea.
Corresponding author: Bock Hur. Department of Conservative Dentistry, College of Dentisty, Pusan National University, 1-10 Ami-dong, Seo-gu, Pusan, 602-739, Korea. Tel: 82-51-240-7454, bhur@pusan.ac.kr

Abstract

The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test.

The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM), Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth, and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy, after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test, resin-bonded teeth were sectioned to give a bonded surface area of 1mm2. Microtensile bond strength test was perfomed.

The results of this study were as follows.

1. A definite etching pattern was observed in Scotchbond Multi-Purpose group.

2. Self-etching groups were characterized as shallow and irregular etching patterns.

3. The results (mean) of microtensile bond strength were SM; 26.55 MPa, SE; 18.15 MPa, LP; 15.57 MPa. SM had significantly higher microtensile bond strength than SE and PL (p < 0.05), but there was no significant differance between SE and PL.

Keywords: Etching effect; Microtensile bond strength; Total etching; Self etching; Enamel; Scanning electron microscopy

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Article information Continued

Copyright © 2004 Korean Academy of Conservative Dentistry
(open-access) :

This is an Open Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Figure 1

Figure 1

The SEM photographs of resin replica using Scotchbond Multi-Purpose

Figure 2

Figure 2

The SEM photographs of resin replica using Clearfil SE Bond

Figure 3

Figure 3

The SEM photographs of resin replica using Adper Prompt L-Pop

Table 1

Composition of three dentin bonding systems

Table 1

Table 2

Procedures of bonding agent application

Table 2

Table 3

Microtensile bond strengths(MPa, Mean ± SD)

Table 3